SKU: 86107923857
Ships within 48 hours · Estimated delivery Sep 5 - Sep 10
YIHUA 862D+ BGA 2 in 1 Rework Station Tool / Cell Phone Desoldering Station
jcprogrammer
1x Repair Tools Set
it can be used for most of phone motherboard repairing & soldering service
RL-044 BGA Stencil For iPhone Huawei Samsung Xiaomi Android CPU Back Glass Replacement YIHUA 862D+ BGA 2 inRELIFE RL 044 Precision BGA Reballing Stencil CPU Chip Integrated Steel Mesh For iPhone 6 15 Pro Max, Huawei, Samsung Xiaomi and Android CPU series (SMC Qualcomm Snapdragon series, MTC Dimensity series, HIC hisilicon Kirin series, EMMC BGA series, ACU Android series). RELIFE RL 044 Integrated Tin Planting Steel Stencil For iPhone Huawei Samsung Xiaomi Android CPU RAM Power IC Chip Soldering Reballing Repair. Option: 1. RELIFE RL 044 iPhone series BGA
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